Thermal Analysis for electronics
Thermal Analysis For PCB
Objective : Find out temperature profile, check the junction and case temperature at different ambient temperature to determine the temperature does not cross the Allowable limit

Heat Sink Optimization
Objective : Optimize the heat sink so that maximum amount of heat is dissipated to the environment.
Initially baseline model was analysed, then the height, length,width of the fin was varied and after several iterations the optimum fin dimension was found out.
