Thermal Analysis for electronics

Thermal Analysis For PCB

Objective : Find out temperature profile, check the junction and case temperature at different ambient temperature to determine the temperature does not cross the Allowable limit

thermal analysis

Heat Sink Optimization

Objective : Optimize the heat sink so that maximum amount of heat is dissipated to the environment.

Initially baseline model was analysed, then the height, length,width of the fin was varied and after several iterations the optimum fin dimension was found out.

thermal analysis
Aerospace CFD
Automotive CFD
Case Studies